Maitian New Material
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11
2023
-
09
Looking for superhard ink or glue for surface encapsulation
Author:
Material requirement: Purpose: Used for surface packaging protection of sensor glass module products (with micrometer level metal circuits on the surface of the substrate glass, and then coated with silicon nitride)
Usage: Printing or piezoelectric valve spraying on the surface of electronic products, printing method is preferred, and curing method is not limited
The requirements are as follows: 1. The hardness of Japanese Mitsubishi pencils shall not be less than 6H
Soak in 284 disinfectant solution for 30 minutes, with a scale of 5B
Sensor glass module ESD air 15KV passing through after applying glue or printing ink (20-60um)
4. Surface requirements: fingerprint proof, matte matte, excellent
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